Infineon Announces Next Generation Wireless Platform Architecture
CANNES, France--(BUSINESS WIRE)--Feb. 19, 2002--Infineon
Technologies launched its Next Generation Wireless Platform
Architecture which will drive the proliferation of wireless multimedia
communication products. The unified architecture will create the basis
for 2G, 2.5G and 3G terminal products, provide scalable support for
mobile applications, offer an open application software interface and
enable flexibly customized terminal solutions.
Infineon's Next Generation Wireless Platform Architecture is a
unified system-level platform covering hardware and software as well
as access and applications technologies. The platform is open in terms
of software interfaces and APIs, as well as scalable and modular to
allow rapid and "right first time" delivery of products tailored to
specific market segments and specific customer needs.
Infineon's Next Generation Wireless Platform Architecture will
include a Wireless Computing Engine with baseband support for
GSM/GPRS/EGPRS/UMTS and scalable application performance based on an
ARM(TM) 926-CPU. Additional hardware components of the architecture
include an Air Interface Unit and power management. The modular and
scalable software architecture comprises protocol stacks, system
services, operating systems and an open interface to application
software. A development platform for customer system software will be
available in Q4 2002.
"Infineon's unified Next Generation Wireless Platform will permit
customers to flexibly address the increasingly diversifying market
segments," said Ulrich Hamann, Chief Executive Officer of the Business
Group Wireless Solutions at Infineon Technologies. "Both, scalability
and durability of the architecture are an essential basis for
individualized communications products and will enable fast time to
market."
The introduction of GPRS and 3G into the wireless market initiates
an important transition for the wireless industry. GPRS, and 3G even
more so, are expected to ignite the evolution of a wide variety of
terminal classes from relatively basic terminals to high-end
multimedia-enabled terminals. This will lead to an increased degree of
segmentation and diversification of end user markets.
It is this anticipated increase in segmentation of the markets
that creates for both the established players and for new entrants a
strong need for a unified and flexibly scalable platform that serves
as a durable basis for application and device developers. Applications
once written are supposed to be forward and backward compatible, and
largely independent of the underlying modem technology as well as the
specific device implementation. This is of eminent importance to
permit prolific development of a broad set of terminals and
applications.
This concept is based on Infineon's experience derived from the
existing 3G program. Infineon showed its 3G experience in Cannes with
a live demonstration of the predecessor of its wireless computing
engine. Infineon's 3G RF solutions are today supplied to FOMA (Freedom
of Multimedia Access) terminal products in Japan. Sampling of highly
integrated UMTS transceiver components has already started.
About Infineon
Infineon Technologies AG, Munich, Germany, offers semiconductor
and customized solutions for applications in the wired and wireless
communications markets, for security systems and smartcards, for the
automotive and industrial sectors, as well as memory products. With a
global presence, Infineon operates in the US from San Jose, CA, in the
Asia-Pacific region from Singapore and in Japan from Tokyo. In the
fiscal year 2001 (ending September), the company achieved sales of
Euro 5.67 billion with about 33,800 employees worldwide. Infineon is
listed on the DAX index of the Frankfurt Stock Exchange and on the New
York Stock Exchange (ticker symbol: IFX). Further information is
available at www.infineon.com.
This news release is available online at
http://www.infineon.com/news
Infineon and the stylized Infineon Technologies design are
registered trademarks and service marks of Infineon Technologies AG.
Other product and brand names may be trademarks or registered
trademarks of their respective owners.
For the Trade Press: INFWS200202.043e
Contact:
Infineon
Guenter Gaugler +49 89 234 28481 (Headquarters)
guenter.gaugler@infineon.com
Toni Goodrich, 408/501-6382
toni.goodrich@infineon.com
Kaye Lim, +65 8400 689 (Asia)
kaye.lim@infineon.com
Hirotaka Shiroguchi, +81 3 5449 6795 (Japan)
hirotaka.shiroguchi@infineon.com
Investor Relations +49 89 234 26655
investor.relations@infineon.com
